Notes

a. Pulse test; pulse width

≤ 300 μs, duty cycle ≤ 2 %.

b. Guaranteed by design, not subject to production testing.

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation

of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum

rating conditions for extended periods may affect device reliability.

SPECIFICATIONS (TJ = 25 °C, unless otherwise noted)

PARAMETER

SYMBOL

TEST CONDITIONS

MIN.

TYP.

MAX.

UNIT

Static

Drain-Source Breakdown Voltage

VDS

VGS = 0 V, ID = -250 μA

-60

-

-

V

VDS Temperature Coefficient

ΔVDS/TJ

ID = -250 μA

--6.7

-

mV/°C

VGS(th) Temperature Coefficient

ΔVGS(th)/TJ

-4.3

-

Gate-Source Threshold Voltage

VGS(th)

VDS = VGS, ID = -250 μA

-1

-

-3

V

Gate-Source Leakage

IGSS

VDS = 0 V, VGS = ± 20 V

-

-

± 100

nA

Zero Gate Voltage Drain Current

IDSS

VDS = -60 V, VGS = 0 V

-

-

-1

μA

VDS = -60 V, VGS = 0 V, TJ = 55 °C

-

-

-5

On-State Drain Current a

ID(on)

VDS

≥ -10 V, VGS = -10 V

-30

-

-

A

Drain-Source On-State Resistance a

RDS(on)

VGS = -10 V, ID = -3.5 A

-

0.070

Ω

VGS = -4.5 V, ID = -2.8 A

-

0.085

Forward Transconductance a

gfs

VDS = -30 V, ID = -3.5 A

-

11

-

S

Dynamic b

Input Capacitance

Ciss

VDS = -30 V, VGS = 0 V, f = 1 MHz

-

832

-

pF

Output Capacitance

Coss

-88

-

Reverse Transfer Capacitance

Crss

-63

-

Total Gate Charge

Qg

VDS = -30 V, VGS = -10 V, ID = -3.5 A

-

20

30

nC

VDS = -30 V, VGS = -4.5 V, ID = -3.5 A

-

10.1

15.2

Gate-Source Charge

Qgs

-3.3

-

Gate-Drain Charge

Qgd

-3.9

-

Gate Resistance

Rg

f = 1 MHz

1.8

9

18

Ω

Turn-On Delay Time

td(on)

VDD = -30 V, RL = 10.7

Ω

ID

≅ -2.8 A, VGEN = -10 V, Rg = 1 Ω

-8

16

ns

Rise Time

tr

-6

12

Turn-Off DelayTime

td(off)

-35

53

Fall Time

tf

-16

24

Turn-On Delay Time

td(on)

VDD = -30 V, RL = 10.7

Ω

ID

≅ -2.8 A, VGEN = -4.5 V, Rg = 1 Ω

-40

60

Rise Time

tr

-28

42

Turn-Off DelayTime

td(off)

-31

47

Fall Time

tf

-15

23

Drain-Source Body Diode Characteristics

Continous Source-Drain Diode Current

IS

TC = 25 °C

-

-

-3.5

A

Pulse Diode Forward Current (t = 100 μs)

ISM

--

-20

Body Diode Voltage

VSD

IS = -2.8 A, VGS = 0 V

-

-0.85

-1.2

V

Body Diode Reverse Recovery Time

trr

IF = -2.8 A, dI/dt = 100 A/μs,

TJ = 25 °C

-32

48

ns

Body Diode Reverse Recovery Charge

Qrr

-45

68

nC

Reverse Recovery Fall Time

ta

-24

-

ns

Reverse Recovery Rise Time

tb

-8

-

2

UT6401L-AG6-R

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