LTM4650-2

2

Rev. 0

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PIN CONFIGURATION

ABSOLUTE MAXIMUM RATINGS

(Note 1)

ELECTRICAL CHARACTERISTICS The

l

denotes the specifications which apply over the specified internal

operating junction temperature range. Specified as each individual output channel. TA = 25°C (Note 2), VIN = 12V and VRUN1, VRUN2 at

5V unless otherwise noted. Per the typical application in Figure 24.

SYMBOL

PARAMETER

CONDITIONS

MIN

TYP

MAX

UNITS

VIN

Input DC Voltage

l

4.5

15

V

VOUT

Output DC Voltage

l

0.6

1.8

V

VOUT1(DC),

VOUT2(DC)

Output Voltage, Total Variation with

Line and Load

CIN = 22µF ×3, COUT = 100µF ×2 Ceramic,

470µF POSCAP, VIN = 12V, VOUT = 1.2V,

IOUT = 0A to 25A

l

1.182

1.218

V

Input Specifications

VRUN1, VRUN2

RUN Pin On/Off Threshold

RUN Rising

1.1

1.25

1.40

V

VRUN1HYS, VRUN2HYS RUN Pin On Hysteresis

150

mV

ORDER INFORMATION

VIN ..............................................................–0.3V to 16V

VSW1, VSW2....................................................–1V to 16V

PGOOD1, PGOOD2, RUN1, RUN2,

INTVCC, EXTVCC .......................................... –0.3V to 6V

MODE_PLLIN, fSET, TRACK1, TRACK2,

DIFFOUT, PHASMD ............................... –0.3V to INTVCC

VOUT1, VOUT2, VOUTS1, VOUTS2 (Note 6)........ –0.3V to 6V

DIFFP, DIFFN ......................................... –0.3V to INTVCC

INTVCC Peak Output Current................................100mA

Internal Operating Junction Temperature Range

(Note 2) ............................................. –40°C to 125°C

Storage Temperature Range .................. –55°C to 125°C

Peak Package Body Temperature.......................... 245°C

BGA PACKAGE

144-PIN (16mm × 16mm × 5.01mm)

TJMAX = 125°C, θJA = 7°C/W, θJCbottom = 1.5°C/W,

θJCtop = 3.7°C/W, θJB + θJBA ≅ 7°C/W

θ VALUES DEFINED PER JESD 51-12

WEIGHT = 3.5g

TOP VIEW

TEMP

CLKOUT

SW1

PHASMD

EXTVCC

1

2

3

4

5

6

7

8

10

9

11

12

L

K

J

H

G

F

E

D

C

B

M

A

SW2

PGOOD1

PGOOD2

RUN2

TRACK2

INTVCC

VOUTS2

DIFFP

DIFFOUT

DIFFN

RUN1

TRACK1

MODE_PLLIN

VFB1

VOUTS1

fSET

SGND

COMP1 COMP2

SGND

VFB2

VIN

VOUT2

GND

GND

VOUT1

SGND

GND

PART NUMBER

PAD OR BALL FINISH*

PART MARKING

PACKAGE TYPE

MSL

RATING

TEMPERATURE 

RANGE (Note 2)

DEVICE

FINISH CODE

LTM4650EY-2#PBF

SAC305 (RoHS)

LTM4650Y-2

e1

BGA

4

–40°C to 125°C

LTM4650IY-2#PBF

SAC305 (RoHS)

LTM4650Y-2

e1

BGA

4

–40°C to 125°C

LTM4650IY-2

SnPb (63/37)

LTM4650Y-2

e0

BGA

4

–40°C to 125°C

• Contact the factory for parts specified with wider operating temperature ranges.

*Pad or ball finish code is per IPC/JEDEC J-STD-609.

• Recommended LGA and BGA PCB Assembly and

Manufacturing Procedures

• LGA and BGA Package and Tray Drawings