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ADS6445 数据表(PDF) 3 Page - STMicroelectronics |
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ADS6445 数据表(HTML) 3 Page - STMicroelectronics |
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3 / 75 page  www.ti.com ABSOLUTE MAXIMUM RATINGS (1) ADS6445, ADS6444 ADS6443, ADS6442 SLAS531 – MAY 2007 PACKAGE/ORDERING INFORMATION(1) SPECIFIED TRANSPORT PACKAGE PACKAGE PRODUCT PACKAGE-LEAD TEMPERATURE ORDERING NUMBER MEDIA, DESIGNATOR MARKING RANGE QUANTITY ADS6445IRGCT 250, Tape/reel ADS6445 QFN-64(2) RGC –40 °C to 85°C AZ6445 ADS6445IRGCR 2000, Tape/reel ADS6444IRGCT 250, Tape/reel ADS6444 QFN-64(2) RGC –40 °C to 85°C AZ6444 ADS6444IRGCR 2000, Tape/reel ADS6443IRGCT 250, Tape/reel ADS6443 QFN-64(2) RGC –40 °C to 85°C AZ6443 ADS6443IRGCR 2000, Tape/reel ADS6442IRGCT 250, Tape/reel ADS6442 QFN-64(2) RGC –40 °C to 85°C AZ6442 ADS6442IRGCR 2000, Tape/reel (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. (2) For thermal pad size on the package, see the mechanical drawings at the end of this data sheet. θ JA = 23.17 °C/W (0 LFM air flow), θJC = 22.1 °C/W when used with 2 oz. copper trace and pad soldered directly to a JEDEC standard four layer 3 in. x 3 in. PCB. VALUE UNIT AVDD Supply voltage range –0.3 to 3.9 V LVDD Supply voltage range –0.3 to 3.9 V Voltage between AGND and DGND –0.3 to 0.3 V Voltage between AVDD to LVDD –0.3 to 3.3 V Voltage applied to external pin, VCM –0.3 to 2.0 V Voltage applied to analog input pins – 0.3V to minimum ( 3.6, AVDD + 0.3V) V TA Operating free-air temperature range –40 to 85 °C TJ Operating junction temperature range 125 °C Tstg Storage temperature range –65 to 150 °C Lead temperature 1,6 mm (1/16") from the case for 10 seconds 220 °C (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 3 Submit Documentation Feedback |
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