| 数据搜索系统,热门电子元器件搜索 |
|
AS7221 数据表(PDF) 10 Page - OSRAM GmbH |
|
|
|||||||||||||||||||||||||||||
AS7221 数据表(HTML) 10 Page - OSRAM GmbH |
|
10 / 56 page ![]() Document Feedback AS7221 Absolute Maximum Ratings Datasheet • PUBLIC DS000479 • v4-00 • 2019-Jun-28 55 │ 9 4 Absolute Maximum Ratings Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only. Functional operation of the device at these or any other conditions beyond those indicated under “Operating Conditions” is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. The device is not designed for high-energy UV (ultraviolet) environments, including upward looking outdoor applications, which could affect long-term optical performance. All voltages with respect to GND. Device parameters are guaranteed at VDD = 3.3 V and TAMB = 25 °C unless otherwise noted. Figure 5 Absolute Maximum Ratings of AS7221 Symbol Parameter Min Typ Max Unit Comments Electrical Parameters VDD_MAX Supply Voltage VDD -0.3 5 V Pin VDD to GND, Low Voltage pin VDDHV_MAX Supply Voltage VDDHV -0.3 20 V Pin VDDHV to GND, High Voltage pin VDD_IO Input/Output Pin Voltage -0.3 VDD + 0.3 V Low Voltage pins to GND VDDHV_IO Input/Output Pin Voltage -0.3 VDDHV + 0.3 V High Voltage pins to GND ISCR Input Current (latch-up immunity) ± 100 mA JESD78D Electrostatic Discharge ESDHBM Electrostatic Discharge HBM ±1000 V JS-001-2014 ESDCDM Electrostatic Discharge CDM ±500 V JEDEC JESD22-C101F Oct 2013 Temperature Ranges and Storage Conditions TSTRG Storage Temperature -40 85 °C TBODY Package Body Temperature 260 °C IPC/JEDEC J-STD-020 (1) RHNC Relative Humidity (non- condensing) 5 85 % MSL Moisture Sensitivity Level 3 Represents a 168 hour max. floor lifetime Bump Temperature (soldering) TPEAK (1) Peak Temperature 235 245 °C Solder Profile (1) The reflow peak soldering temperature (body temperature) is specified according to IPC/JEDEC J-STD-020 “Moisture/Reflow Sensitivity Classification for no hermetic Solid State Surface Mount Devices.” The lead finish for Pb-free leaded packages is “Matte Tin” (100 % Sn) |
|
链接网址 |
| ALLDATASHEET是否为您带来帮助? [ DONATE ] |
关于 Alldatasheet | 广告服务 | 联系我们 | 隐私政策 | 数据表链接 | 链接交换 | 制造商名单 All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |