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AS7221 数据表(PDF) 52 Page - OSRAM GmbH |
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AS7221 数据表(HTML) 52 Page - OSRAM GmbH |
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52 / 56 page  Document Feedback AS7221 Soldering & Storage Information Datasheet • PUBLIC DS000479 • v4-00 • 2019-Jun-28 55 │ 51 14 Soldering & Storage Information The module has been tested and has demonstrated an ability to be reflow soldered to a PCB substrate. The solder reflow profile describes the expected maximum heat exposure of components during the solder reflow process of product on a PCB. Temperature is measured on top of the component. The components should be limited to a maximum of three passes through this solder reflow profile. Figure 41: Solder Reflow Profile Graph Figure 42: Solder Reflow Profile Parameter Reference Device Average temperature gradient in preheating 2.5°C/s Soak time tsoak 2 to 3 minutes Time above 217°C (T1) t1 Max 60s Time above 230°C (T2) t2 Max 50s T1 T2 T3 TPEAK Time in seconds tSOAK t1 t2 t3 Not to scale |
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