MPC855T datasheet(7/80 Pages) FREESCALE

7 / 80 page

MPC860 Family Hardware Specifications, Rev. 7

Freescale Semiconductor

Power Dissipation

Table 5 provides power dissipation information. The modes are 1:1, where CPU and bus speeds are equal, and 2:1,

where CPU frequency is twice the bus speed.

NOTE

Values in Table 5 represent VDDL-based power dissipation and do not include I/O

power dissipation over VDDH. I/O power dissipation varies widely by application

due to buffer current, depending on external circuitry.

Table 4. MPC860 Thermal Resistance Data

Rating

Environment

Symbol

MPC860P

ZQ / VR

MPC860P

Unit

Mold Compound Thickness

0.85

1.15

Junction-to-ambient 1

Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)

temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal

resistance.

Natural convection

Single-layer board (1s)

RθJA

Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.

°C/W

Four-layer board (2s2p)

RθJMA

Per JEDEC JESD51-6 with the board horizontal.

Airflow (200 ft/min)

Single-layer board (1s)

RθJMA

Four-layer board (2s2p)

RθJMA

Junction-to-board 4

Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured

on the top surface of the board near the package.

RθJB

Junction-to-case 5

Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate

method (MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature. For exposed pad

packages where the pad would be expected to be soldered, junction-to-case thermal resistance is a simulated value from

the junction to the exposed pad without contact resistance.

RθJC

Junction-to-package top 6

Thermal characterization parameter indicating the temperature difference between the package top and the junction

temperature per JEDEC JESD51-2.

Natural convection

ΨJT

Table 5. Power Dissipation (PD)

Die Revision

Frequency (MHz)

Typical 1

Typical power dissipation is measured at 3.3 V.

Maximum 2

Maximum power dissipation is measured at 3.5 V.

Unit

D.4

(1:1 mode)

656

735

TBD

D.4

(2:1 mode)

722

762

851

909

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