MPC8271VRM datasheet(54/60 Pages) FREESCALE

部件名	MPC8271VRM

功能描述	PowerQUICC II??Family Hardware Specifications

PDF	60 Pages

Scroll/Zoom	100%

制造商	FREESCALE [Freescale Semiconductor, Inc]

网页	http://www.freescale.com

标志

54 / 60 page

MPC8272 PowerQUICC II™ Family Hardware Specifications, Rev. 1.5

Freescale Semiconductor

Package

9Package

Figure 13 shows the side profile of the PBGA package.

Figure 13. Side View of the PBGA Package Remove

Table 21 provides package parameters. Figure 14 provides the mechanical dimensions and bottom surface

nomenclature of the 516 PBGA package.

NOTE: Temperature Reflow for the VR Package

In the VR package, sphere composition is lead-free (refer to Table 2). This

requires higher temperature reflow than what is required for other

PowerQUICC II packages. Users should consult “Freescale

PowerQUICC II™ Pb-Free Packaging Information”

(MPC8250PBFREEPKG) available at www.freescale.com.

Table 21. Package Parameters

Code

Type

Outline

(mm)

Interconnects

Pitch

(mm)

Nominal Unmounted

Height (mm)

VR, ZQ

PBGA

27 x 27

516

2.25

Die

Transfer molding compound

1 mm pitch

Wire bonds

attach

DIE

Ball bond

Screen-printed

solder mask

Cu substrate traces

Resin glass epoxy

Plated substrate via

MPC8271VRM 数据表(PDF) 54 Page - Freescale Semiconductor, Inc

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