SCA61T Series

VTI Technologies Oy

Subject to changes

16/18

www.vti.fi

Doc. nr. 8261900

Rev.A

3.2

Recommended Printed Circuit Board Footprint

Figure 15.

Recommended PCB footprint

4

Mechanical Specifications and Reflow Soldering

4.1

Mechanical Specifications (Reference only)

Lead frame material:

Copper

Plating:

Nickel followed by Gold

Solderability:

JEDEC standard: JESD22-B102-C

RoHS compliance:

RoHS compliant lead free component.

Co-planarity error

0.1mm max.

The part weights

<1 g

Figure 16.

Mechanical dimensions of the SCA61T. (Dimensions in mm)