SCA61T Series

VTI Technologies Oy

Subject to changes

17/18

www.vti.fi

Doc. nr. 8261900

Rev.A

4.2

Reflow Soldering

The SCA61T is suitable for Sn-Pb eutectic and Pb- free soldering process and mounting with

normal SMD pick-and-place equipment.

Figure 17.

Recommended SCA61T body temperature profile during reflow soldering. Ref.

IPC/JEDEC J-STD-020B.

Profile feature

Sn-Pb Eutectic

Assembly

Pb-free Assembly

3°C/second max.

3°C/second max.

Preheat

-

-

-

Time (min to max) (ts)

100°C

150°C

60-120 seconds

150°C

200°C

60-180 seconds

Tsmax to T, Ramp up rate

3°C/second max

Time maintained above:

-

-

183°C

60-150 seconds

217°C

60-150 seconds

240 +0/-5°C

250 +0/-5°C

10-30 seconds

20-40 seconds

Ramp-down rate

6°C/second max

6°C/second max

Time 25° to Peak temperature

6 minutes max

8 minutes max

The Moisture Sensitivity Level of the part is 3 according to the IPC/JEDEC J-STD-020B. The part

should be delivered in a dry pack. The manufacturing floor time (out of bag) in the customer’s end

is 168 hours.

Notes:

•

Preheating time and temperatures according to solder paste manufacturer.

•

It is important that the part is parallel to the PCB plane and that there is no angular alignment

error from intended measuring direction during assembly process.

•

Wave soldering is not recommended.

•

Ultrasonic cleaning is not allowed

. The sensing element may be damaged by ultrasonic

cleaning process.