© 2007 Microchip Technology Inc.

DS22008B-page 17

MCP1702

3-Lead Plastic Small Outline Transistor (CB) [SOT-23A]

Notes:

1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.127 mm per side.

2. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Note:

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Units

MILLIMETERS

Dimension Limits

MIN

NOM

MAX

Number of Pins

N

3

Lead Pitch

e

0.95 BSC

Outside Lead Pitch

e1

1.90 BSC

Overall Height

A

0.89

–

1.45

Molded Package Thickness

A2

0.90

–

1.30

Standoff

A1

0.00

–

0.15

Overall Width

E

2.10

–

3.00

Molded Package Width

E1

1.20

–

1.80

Overall Length

D

2.70

–

3.10

Foot Length

L

0.15

–

0.60

Foot Angle

φ

0°

–

30°

Lead Thickness

c

0.09

–

0.26

Lead Width

b

0.30

–

0.51

D

e

e1

2

1

E

E1

N

b

A

A1

A2

c

L

φ

Microchip Technology Drawing C04-130B