MCP1702

DS22008B-page 18

© 2007 Microchip Technology Inc.

3-Lead Plastic Small Outline Transistor Header (MB) [SOT-89]

Notes:

1. Dimensions D and E do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.127 mm per side.

2. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Note:

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Units

MILLIMETERS

Dimension Limits

MIN

MAX

Number of Leads

N

3

Pitch

e

1.50 BSC

Outside Lead Pitch

e1

3.00 BSC

Overall Height

A

1.40

1.60

Overall Width

H

3.94

4.25

Molded Package Width at Base

E

2.29

2.60

Molded Package Width at Top

E1

2.13

2.29

Overall Length

D

4.39

4.60

Tab Length

D1

1.40

1.83

Foot Length

L

0.79

1.20

Lead Thickness

c

0.35

0.44

Lead 2 Width

b

0.41

0.56

Leads 1 & 3 Width

b1

0.36

0.48

D

D1

E

H

N

b1

e1

b

2

1

e

b1

L

A

C

E1

Microchip Technology Drawing C04-029B