ADL5205ACPZ-R7 datasheet(6/31 Pages) AD

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ADL5205

Data Sheet

Rev. A | Page 6 of 31

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Rating

Differential Output Voltage Swing ×

Bandwidth Product

3 V-GHz

Supply Voltage, VPOS

5.4 V

PWUPA, PWUPB, A0 to A5, B0 to B5, MODE0,

MODE1, PM, LATCH A, LATCH B

−0.5 V to +3.6 V

Input Voltage (VINx+ ,VINx−)

−0.5 V to +3.1 V

Differential Input Voltage ((VINx+) − (VINx−))1

±1 V

Internal Power Dissipation

1000 mW

Maximum Junction Temperature

135°C

Operating Temperature Range

−40°C to +85°C

Storage Temperature Range

−65°C to +150°C

1 The differential input voltage limit is significantly lower than the maximum

input swing of 8 V p-p. The maximum input swing is for the lowest gain

setting of −9 dB. As the gain setting is increased, the maximum input swing

must be reduced correspondingly to maintain the same maximum output

swing. The differential input voltage limit takes effect at greater than ~14 dB,

at which point there is no more resistive attenuation on the input and the

signal presented on the pins goes directly on an input ESD protection circuit.

Therefore, the input signal swing must be limited to a low value.

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

Table 4 shows the thermal resistance from the die to ambient

(θJA), die to board (θJB), and die to lead (θJC), respectively.

Table 4. Thermal Resistance

Package Type

θJA

θJB

θJC

Unit

40-Lead LFCSP

47.7

24.4

15.4

°C/W

JUNCTION TO BOARD THERMAL IMPEDANCE

The junction to board thermal impedance (θJB) is the thermal

impedance from the die to the leads of the ADL5205. The value

given in Table 4 is based on the standard printed circuit board

(PCB) described in the JESD51-7 standard for thermal testing

of surface-mount components. PCB size and complexity (number

of layers) affect θJB; more layers tend to reduce thermal impedance

slightly.

If the PCB temperature is known, use the junction to board

thermal impedance to calculate the die temperature (also

known as the junction temperature) to ensure that the die

temperature does not exceed the specified limit of 135°C. For

example, if the PCB temperature is 85°C, the die temperature is

given by

TJ = TB + (PDISS × θJB)

The worst case power dissipation for the ADL5205 is 919 mW

(5.25 V × 175 mA, see Table 1). Therefore, TJ is

TJ = 85°C + (0.919 W × 24.4°C/W) = 107.4°C

ESD CAUTION

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