Data Sheet

ADPL44002

analog.com

Rev. 0

6 of 23

ABSOLUTE MAXIMUM RATINGS

Table 3. Absolute Maximum Ratings

PARAMETER

RATING

VIN to GND

–0.3V to +44V

VOUT to GND

–0.3 to VIN

EN to GND

–0.3V to +44V

SENSE/ADJ to GND

–0.3V to +6V

SS to GND

–0.3V to VIN or +6V (whichever is less)

Storage Temperature Range

–65°C to +150°C

Junction Temperature (TJ)

150°C

Operating Ambient Temperature

(TA) Range

–40°C to +125°C

Soldering Conditions

JEDEC J-STD-020

ESD

6-Lead LFCSP

Human Body Model (HBM)

±1000V

6-Lead LFCSP

Field Induced Charged Device

Model (FICDM)

±1000V

5-Lead TSOT

HBM

±1000V

5-Lead TSOT

FICDM

±1250V

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These

are stress ratings only, functional operation of the product at these or any other conditions above those indicated in

the operational section of this specification is not implied. Operation beyond the maximum operating conditions for

extended periods may affect product reliability.

Thermal Data

Absolute maximum ratings apply individually only, not in combination. The ADPL44002 can be damaged when the

junction temperature limits are exceeded. Monitoring ambient temperature does not guarantee that TJ is within the

specified temperature limits. In applications with high power dissipation and poor thermal resistance, the maximum

ambient temperature may have to be derated.

In applications with moderate power dissipation and low printed circuit board (PCB) thermal resistance, the

maximum ambient temperature can exceed the maximum limit as long as the junction temperature is within

specification limits. The junction temperature of the device is dependent on the ambient temperature, the power

dissipation (PD) of the device, and the junction-to-ambient thermal resistance of the package (θJA).

Maximum TJ is calculated from the TA and PD using the formula.

TJ = TA + PD × θJA

(1)