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ADPL44002ACPZN2.5-R7 数据表(PDF) 18 Page - Analog Devices

部件名 ADPL44002ACPZN2.5-R7
功能描述  40V, 200mA, Low Noise, CMOS LDO Linear Regulator
PDF  23 Pages
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制造商  AD [Analog Devices]
网页  http://www.analog.com
标志 AD - Analog Devices

ADPL44002ACPZN2.5-R7 数据表(HTML) 18 Page - Analog Devices

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Data Sheet
ADPL44002
analog.com
Rev. 0
18 of 23
Current-Limit and Thermal Overload
The ADPL44002 is protected against damage due to excessive power dissipation by current and thermal overload
protection circuits. The ADPL44002 is designed to current limit when the output load reaches 360mA (typical). When
the output load exceeds 360mA, the output voltage is reduced to maintain a constant current limit.
Thermal overload protection is included, which limits the junction temperature to a maximum of 150°C (typical).
Under extreme conditions (that is, high ambient temperature and/or high power dissipation), when the junction
temperature starts to rise above 150°C, the output is turned off, reducing the output current to zero. When the
junction temperature drops below 135°C, the output is turned on again, and the output current is restored to its
operating value.
Consider the case where a hard short from VOUT to ground occurs. At first, the ADPL44002 current limits, so that only
360mA is conducted into the short. If self heating of the junction is great enough to cause its temperature to rise
above 150°C, thermal shutdown activates, turning off the output and reducing the output current to zero. As the
junction temperature cools and drops below 135°C, the output turns on and conducts 360mA into the short, again
causing the junction temperature to rise above 150°C. This thermal oscillation between 135°C and 150°C causes a
current oscillation between 360mA and 0mA that continues as long as the short remains at the output.
Current and thermal limit protections protect the device against accidental overload conditions. For reliable
operation, device power dissipation must be externally limited so that the junction temperature does not exceed
125°.
PRINTED CIRCUIT BOARD LAYOUT CONSIDERATIONS
Heat dissipation from the package can be improved by increasing the amount of copper attached to the pins of the
ADPL44002. However, a point of diminishing returns is eventually reached, beyond which an increase in the copper
size does not yield significant heat dissipation benefits.
Place the input capacitor as close as possible to the VIN pin and GND pin. Place the output capacitor as close as
possible to the VOUT and GND pins. The use of 0805 or 1206 size capacitors and resistors achieves the smallest possible
footprint solution on boards where area is limited.



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