www.ti.com

EEPROM

Xin/CLK

Xout

GND

InputClock

S0

Programming

and

SDA/SCL

Register

Y2

Y1

Y3

LV

CMOS

Pdiv1

10-Bit

LV

CMOS

Pdiv3

7-Bit

Pdiv2

7-Bit

PLL Bypass

LV

CMOS

PLL 1

withSSC

S1/SDA

S2/SCL

VCXO

XO

LVCMOS

ABSOLUTE MAXIMUM RATINGS

PACKAGE THERMAL RESISTANCE for TSSOP (PW) PACKAGE

(1) (2)

CDCE913

CDCEL913

SCAS849A – JUNE 2007 – REVISED AUGUST 2007

over operating free-air temperature range (unless otherwise noted)

(1)

VALUE

UNIT

Supply voltage range

–0.5 to 2.5

V

V

V

20

mA

Continuous output current

50

mA

Storage temperature range

–65 to 150

°C

Maximum junction temperature

125

°C

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

The input and output negative voltage ratings may be exceeded if the input and output clamp-current ratings are observed.

over operating free-air temperature range (unless otherwise noted)

AIRFLOW

TSSOP14

PARAMETER

(lfm)

°C/W

0

112

150

105

Thermal resistance junction-to-ambient

250

102

500

97

Thermal resistance junction-to-case

–

46

(1)

The package thermal impedance is calculated in accordance with JESD 51 and JEDEC2S2P (high-k board).

(2)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

website at www.ti.com.

Copyright © 2007, Texas Instruments Incorporated

Submit Documentation Feedback

3

Product Folder Link(s): CDCE913 CDCEL913