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STE2004S 数据表(PDF) 77 Page - STMicroelectronics |
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STE2004S 数据表(HTML) 77 Page - STMicroelectronics |
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77 / 79 page ![]() STE2004S Pad coordinates 77/79 Figure 76. Alignment marks dimensions Table 31. Bumps Dimensions Bumps size 28 µmX97µmX17.5µm Pad size 35 µm X 104µm Pad pitch 45µm Spacing between bumps 17 µm Table 32. Die mechanical dimensions Die Size (X x Y) 5.815mm x 1.333mm Wafers thickness 500 µm 85 µm 35 µm |
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