Data Sheet

ADP1763

APPLICATIONS INFORMATION

analog.com

Rev. E | 18 of 22

Figure 38. 6400 mm2 of PCB Copper, TA = 50°C

Figure 39. 500 mm2 of PCB Copper, TA = 50°C

Figure 40. 25 mm2 of PCB Copper, TA = 50°C

In cases where the board temperature is known, the thermal char-

acterization parameter (ΨJB) can be used to estimate the junction

temperature rise. The maximum junction temperature (TJ) is calcu-

lated from the board temperature (TB) and power dissipation (PD)

using the following formula:

TJ=TB+ PD×ΨJB

(8)

Figure 41 through Figure 44 show junction temperature calculations

for different board temperatures, load currents, VIN to VOUT differen-

tials, and areas of PCB copper.

Figure 41. 500 mm2 of PCB Copper, TB = 25°C

Figure 42. 500 mm2 of PCB Copper, TB = 50°C