Data Sheet

ADA4352-2

analog.com

Rev 0

15 of 47

PARAMETER

RATING

Temperature Junction, TJ

150°C

Temperature Case, TC

260°C

.

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These

are stress ratings only, functional operation of the product at these or any other conditions above those indicated

in the operational section of this specification is not implied. Operation beyond the maximum operating conditions

for extended periods may affect product reliability.

Thermal Resistance

Thermal performance is directly linked to PCB design and operating environment. Close attention to PCB thermal

design is required.

θJA is the natural convection junction-to-ambient thermal resistance measured in a one cubic foot sealed

enclosure.

Thermal Resistance

Package Type

ӨJA

Unit

CP-16-32

91

°C/W

Maximum Power Dissipation

The maximum safe power dissipation for the ADA4352-2 is limited by the associated rise in TJ on the die. At

approximately 150°C, which is the glass transition temperature, the properties of the plastic change. Even

temporarily exceeding this temperature limit may change the stresses the package exerts on the die, permanently

shifting the parametric performance of the ADA4352-2. Exceeding a TJ of 175°C for an extended period can result in

changes in the silicon devices, potentially causing degradation or loss of functionality.

The power dissipated in the package is the sum of the quiescent power dissipation and the power dissipated in the

die due to the output load drive of the amplifier.

Figure 3. Output Current Derating Curve

MAXIMUM CURRENT (mA)

TEMPERATURE (°C)

25

0

20

40

60

80

100

120

50

75

100

125

150