ADE9103 datasheet(13/55 Pages) AD

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Data Sheet

ADE9103/ADE9112/ADE9113

ABSOLUTE MAXIMUM RATINGS

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Rev. A | 13 of 55

TA = 25°C, unless otherwise noted.

Table 6. ADE9103 Absolute Maximum Ratings

Parameter

Rating

VDD to DGND

−0.3 V to +3.7 V

Analog Input Voltage

IP and IM to DGND

−1.4 V to +1.4 V

V1P and V1M, to DGND

−2.0 V to +2.0 V

V2P and V2M to DGND

−1 V to +1 V

Digital Input Voltage

MOSI, SCLK, CS, RESET, and XTALIN to

DGND

−0.3 V to VDD + 0.3 V

Digital Output Voltage

IRQ, ZX, CLKOUT, MISO, SCLK, and XTAL-

OUT to DGND

−0.3 V to VDD + 0.3 V

Temperature

Operating

−40°C to +125°C

Storage Range

−65°C to +150°C

Lead (Soldering, 10 sec)1

260°C

Moisture Sensitivity Level

MSL3

1 Analog Devices recommends that reflow profiles used in soldering RoHS-com-

pliant devices conform to J-STD-020D.1 from JEDEC. Refer to JEDEC for the

latest revision of this standard.

Table 7. ADE9112/ADE9113 Absolute Maximum Ratings

Parameter

Rating

VDD to DGND and AVDD to AGND

−0.3 V to +3.7 V

Analog Input Voltage

IP and IM to AGND

−1.4 V to +1.4 V

V1P and V1M to AGND

−2.0 V to +2.0 V

V2P and V2M to AGND

−1 V to +1 V

Digital Input Voltage

MOSI, SCLK, CS, RESET, and XTALIN to

DGND

−0.3 V to VDD + 0.3 V

Digital Output Voltage

IRQ, ZX, CLKOUT, MISO, SCLK, and

XTALOUT to DGND

−0.3 V to VDD + 0.3 V

Common-Mode Transients1

−150 kV/μs to +150 kV/μs

Temperature

Operating Range

−40°C to +125°C

Storage Range

−65°C to +150°C

Lead (Soldering, 10 sec)2

260°C

Moisture Sensitivity Level

MSL3

1 Refers to common-mode transients across the insulation barrier. Common-

mode transients exceeding the absolute maximum ratings may cause latch-up

or permanent damage.

2 Analog Devices recommends that reflow profiles used in soldering RoHS-com-

pliant devices conform to J-STD-020D.1 from JEDEC. Refer to JEDEC for the

latest revision of this standard.

Stresses at or above those listed under Absolute Maximum Ratings

may cause permanent damage to the product. This is a stress

rating only; functional operation of the product at these or any other

conditions above those indicated in the operational section of this

specification is not implied. Operation beyond the maximum operat-

ing conditions for extended periods may affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to PCB

thermal design is required.

θJA is the natural convection junction-to-ambient thermal resistance

measured in a one cubic foot sealed enclosure, and θJC is the

junction-to-case thermal resistance.

Table 8. Thermal Resistance

Package Type

θJA

θJC

Unit

RN-28-1

65.69

36.19

°C/W

ELECTROSTATIC DISCHARGE (ESD) RATINGS

The following ESD information is provided for handling of ESD-sen-

sitive devices in an ESD protected area only.

Human body model (HBM) per ANSI/ESDA/JEDEC JS-001.

Charged device model (CDM) per ANSI/ESDA/JEDEC JS-002.

ESD Ratings for ADE9103

Table 9. ADE9103, 28-Lead SOIC_W_FP

ESD Model

Withstand Threshold (V)

Class

HBM

±4000

CDM

±1250

ESD Ratings for ADE9112 and ADE9113

Table 10. ADE9112 and ADE9113, 28-Lead SOIC_W_FP

ESD Model1

Withstand Threshold (V)

Class

HBM

±4000

CDM

±1250

1 With respect to local VDD and AGND, and DGND and GNDISO pins.

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Charged devi-

ces and circuit boards can discharge without detection. Although

this product features patented or proprietary protection circuitry,

damage may occur on devices subjected to high energy ESD.

Therefore, proper ESD precautions should be taken to avoid

performance degradation or loss of functionality.

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