数据搜索系统,热门电子元器件搜索
  Chinese  ▼
ALLDATASHEETCN.COM

X  

CC1070-RTR1 数据表(PDF) 39 Page - Texas Instruments

部件名 CC1070-RTR1
功能描述  Single Chip Low Power RF Transmitter for Narrowband Systems
PDF  57 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
制造商  TI2 [Texas Instruments]
网页  https://www.ti.com
标志 TI2 - Texas Instruments

CC1070-RTR1 数据表(HTML) 39 Page - Texas Instruments

Back Button CC1070-RTR1 Datasheet HTML 35Page - Texas Instruments CC1070-RTR1 Datasheet HTML 36Page - Texas Instruments CC1070-RTR1 Datasheet HTML 37Page - Texas Instruments CC1070-RTR1 Datasheet HTML 38Page - Texas Instruments CC1070-RTR1 Datasheet HTML 39Page - Texas Instruments CC1070-RTR1 Datasheet HTML 40Page - Texas Instruments CC1070-RTR1 Datasheet HTML 41Page - Texas Instruments CC1070-RTR1 Datasheet HTML 42Page - Texas Instruments CC1070-RTR1 Datasheet HTML 43Page - Texas Instruments Next Button
Zoom Inzoom in Zoom Outzoom out
 39 / 57 page
background image
CC1070
SWRS043A
Page 39 of 54
switching the PA back on after a hop has
been performed.
Note
that
the
override
bits
VCO_OVERRIDE, CHP_OVERRIDE and
VCO_CAL_OVERRIDE must be disabled
when performing a re-calibration.
22 PCB Layout Recommendations
A two layer PCB with all components
placed on the top layer can be used. The
bottom layer of the PCB should be the
“ground-layer”.
The top layer should be used for signal
routing, and the open areas should be
filled with metallization connected to
ground using several vias.
The area under the chip is used for
grounding and must be connected to the
bottom ground plane with several vias. In
the TI reference designs we have placed 8
14 mil (0.36 mm) diameter via holes
symmetrically inside the exposed die
attached pad. These vias should be
“tented” (covered with solder mask) on the
component side of the PCB to avoid
migration of solder through the vias during
the solder reflow process.
Each decoupling capacitor should be
placed as close as possible to the supply
pin it is supposed to decouple. Each
decoupling capacitor should be connected
to the power line (or power plane) by
separate vias. The best routing is from the
power line (or power plane) to the
decoupling capacitor and then to the
CC1070 supply pin.. Supply power filtering
is very important, especially for the VCO
supply (pin 15).
Each decoupling capacitor ground pad
should be connected to the ground plane
using a separate via. Direct connections
between neighboring power pins will
increase noise coupling and should be
avoided unless absolutely necessary.
The external components should ideally
be as small as possible and surface mount
devices are highly recommended.
Precaution should be used when placing
the microcontroller in order to avoid noise
interfering with the RF circuitry.
A CC1020/1070DK Development Kit with
a fully assembled CC1070EM Evaluation
Module is available. It is strongly advised
that this reference layout is followed very
closely in order to obtain the best
performance. The layout Gerber files are
available from the TI web site.
23 Antenna Considerations
CC1070 can be used together with various
types of antennas. The most common
antennas for short-range communication
are monopole, helical and loop antennas.
Monopole
antennas
are
resonant
antennas with a length corresponding to
one quarter of the electrical wavelength
(
λ/4). They are very easy to design and
can be implemented simply as a “piece of
wire” or even integrated onto the PCB.
Non-resonant monopole antennas shorter
than
λ/4 can also be used, but at the
expense of range. In size and cost critical
applications such an antenna may very
well be integrated onto the PCB.
Helical antennas can be thought of as a
combination of a monopole and a loop
antenna. They are a good compromise in
size critical applications. But helical
antennas tend to be more difficult to
optimize than the simple monopole.
Loop antennas are easy to integrate into
the PCB, but are less effective due to
difficult impedance matching because of
their very low radiation resistance.



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57


数据表 下载

Go To PDF Page


链接网址



ALLDATASHEET是否为您带来帮助?  [ DONATE ] 

关于 Alldatasheet   |   广告服务   |   联系我们   |   隐私政策   |   数据表链接    |   链接交换   |   制造商名单
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com