LP8553

SNVS701B – SEPTEMBER 2011 – REVISED JANUARY 2014

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PIN DESCRIPTIONS(1)

Pin #

Name

Type

Description

A1

GND_SW

G

Boost switch ground

A2

GND_SW

G

Boost switch ground

A3

EN

I

Enable input pin

A4

PWM

A

PWM dimming input. This pin must be connected to GND if not used.

A5

FB

A

Boost feedback input

B1

SW

A

Boost switch

B2

SW

A

Boost switch

B3

ISET

A

Set resistor for LED current. This pin can be left floating if not used.

B4

FSET

A

PWM frequency set resistor. This pin can be left floating if not used.

B5

GND_S

G

Signal ground

C1

VIN

P

Input power supply up to 22V. If 2.7V

≤ VBATT < 5.5V (Typical Application for Low

Input Voltage (2)) then external 5V rail must be used for VLDO and VIN.

C2

FILTER

A

Low pass filter for PLL. This pin can be left floating if not used.

C3

FAULT

OD

Fault indication output. If not used, can be left floating.

C4

VDDIO

P

Digital IO reference voltage (1.65V...5V) for I2C interface and PWM input.

C5

OUT3

A

Current sink output

D1

VLDO

P

LDO output voltage. External 5V rail can be connected to this pin in low voltage

application.

D2

VSYNC

I

VSYNC input. This pin must be connected to GND if not used.

D3

SCLK

I

Serial clock. This pin must be connected to GND if not used.

D4

SDA

I/O

Serial data. This pin must be connected to GND if not used.

D5

OUT2

A

Current sink output

E1

NC

-

Not connected

E2

NC

-

Not connected

E3

OUT4

A

Current sink output

E4

GND_L

G

LED ground

E5

OUT1

A

Current sink output

(1)

A: Analog Pin, G: Ground Pin, P: Power Pin, I: Input Pin, I/O: Input/Output Pin, O: Output Pin, OD: Open Drain Pin

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

4

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