SN260 datasheet(84/88 Pages) STMICROELECTRONICS

84 / 88 page

Mechanical details

SN260

84/88

Mechanical details

The SN260 package is a plastic 40-pin QFN that is 6mm x 6mm x 0.9mm. A large ground

pad in the bottom center of the package forms an extra 41st pin. A number of thermal vias

should connect the SN260 decal center to a PCB ground plane. For more information, refer

to www.stmcu.com.

Figure 13 illustrates the package drawing.

Figure 13.

Package drawing

Top View

Edge View

Sym.

Minimum

Nominal

Maximum

A0.85

1.90

1.0

Common Dimensions

(mm)

Tolerances for

Form&Position

Sym.

bbb

aaa

0.10

0.15

Notes

1. JEDECref MO

-220

2. All dimensions are in millimeters

3. Pin1

orientation identified by chamfer on corner of

exposed die pad

DatumCand the seating plane are defined by the flat surface

of the metallised terminal

5. Dimension'e' represents the terminal pitch

Dimension b applies to metallised terminal and is measured

1. 25to1.30 mmfromterminal tip

7. Dimension L1

represents terminal pull back frompackage

edge. Where terminal pull back exists

, only upper half of lead is

visible on package edge due to half etching of leadframe

Package surface shall be matte finish

, Ra1.6- 2.2

9. Package warp shall be

1. 150 maximum

10. Leadframe material is copper A

194.

11.

Coplanarity applies to the exposed pad as well as the

terminals.

Detail B

BottomView

ccc

0.10

Detail A

Detail B

Detail A

Pin1

EXPOSED

PAD

0.4000

1.02

1.05

0. 20ref

5.90

6.11

6.10

4.5BSC

4.21

4.31

4.41

5.91

6.10

4.21

4.31

4.41

0.35

0.41

1.45

0.1

0.18

1.23

0.31

N40

e0.50

k1.2

Rb min/2

T0.15

EE1 E2

Nx b

0. 15typ

4.5BSC

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