TS472

Package information

Doc ID 11015 Rev 6

19/25

5

Package information

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®

specifications, grade definitions and product status are available at: www.st.com.

ECOPACK® is an ST trademark.

5.1

Flip-chip package information

Figure 43.

TS472 footprint recommendation

Figure 44.

Pinout (top view)

Pad in Cu 18

μm with Flash NiAu (2-6μm, 0.2μm max.)

150

μm min.

500

μm

500

μm

Φ=250μm

Φ=400μm typ.

75µm min.

100

μm max.

Track

Non Solder mask opening

Φ=340μm min.

Pad in Cu 18

μm with Flash NiAu (2-6μm, 0.2μm max.)

150

μm min.

500

μm

500

μm

Φ=250μm

Φ=400μm typ.

75µm min.

100

μm max.

Track

Non Solder mask opening

Φ=340μm min.

A

C

B

1

2

3

D

IN+

IN-

GND

OUT+

C2

C1

OUTPUT

BIAS

GS

VCC

OUT-

STDBY

BYPASS

A

C

B

1

2

3

D

IN+

IN-

GND

OUT+

C2

C1

OUTPUT

BIAS

GS

VCC

OUT-

STDBY

STDBY

BYPASS

Balls are underneath