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TS472 数据表(PDF) 20 Page - STMicroelectronics |
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TS472 数据表(HTML) 20 Page - STMicroelectronics |
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20 / 25 page ![]() Package information TS472 20/25 Doc ID 11015 Rev 6 Figure 45. Marking (top view) Figure 46. Flip-chip - 12 bumps Figure 47. Tape & reel specification (top view) 472 YWW E 472 YWW E ■ ST logo ■ Part number: 472 ■ E Lead free bumps ■ Three digits datecode: YWW ■ The dot indicates pin A1 ● Die size: 2.1 mm x 1.6 mm ± 30 µm ● Die height (including bumps): 600 µm ● Bumps diameter: 315 µm ±50 µm ● Bump diameter before reflow: 300 µm ±10 µm ● Bump height: 250 µm ±40 µm ● Die height: 350 µm ±20 µm ● Pitch: 500 µm ±50 µm ● Coplanarity: 50 µm max 2.1 mm 1.6 mm 0.5mm 0.5mm ∅ 0.315mm 2.1 mm 1.6 mm 0.5mm 0.5mm ∅ 0.315mm 600µm 600µm User direction of feed 8 Die size X + 70µm 4 1.5 4 All dimensions are in mm A 1 A 1 User direction of feed 8 Die size X + 70µm 4 1.5 4 All dimensions are in mm A 1 A 1 |
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