DocID9309 Rev 14

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TS4990

Package information

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5

Package information

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®

specifications, grade definitions and product status are available at: www.st.com.

ECOPACK® is an ST trademark.

5.1

Flip-chip package information

Figure 65. Flip-chip pinout (top view)

Figure 66. Marking (top view)

A

C

B

1

2

3

Vin-

GND

BYPASS

VOUT2

VCC

Vin+

VOUT1

GND

STBY

A

C

B

1

2

3

Vin-

GND

BYPASS

VOUT2

VCC

Vin+

VOUT1

GND

STBY

Vin-

GND

BYPASS

VOUT2

VCC

Vin+

VOUT1

GND

STBY



Balls are underneath

XXX

YWW

E

XXX

YWW

E

 ST logo

 Product and assembly code:

XXX

A90 from Tours

90S from Shenzhen

 Three-digit datecode: YWW

 E symbol for lead-free only

 Symbol for

lead-free