TS4990 datasheet(32/33 Pages) STMICROELECTRONICS

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Revision history

TS4990

32/33

DocID9309 Rev 14

Revision history

Table 12. Document revision history

Date

Revision

Changes

1-Jul-2002

First release.

4-Sep-2003

Update mechanical data.

1-Oct-2004

Order code for back coating on flip-chip.

2-Apr-2005

Typography error on page 1: Mini-SO-8 pin connection.

May-2005

New marking for assembly code plant.

1-Jul-2005

Error on Table 4 on page 5. Parameters in wrong column.

28-Sep-2005

Updated mechanical coplanarity data to 50 µm (instead of 60 µm) (see

Figure 67 on page 25).

14-Mar-2006

SO-8 package inserted in the datasheet.

21-Jul-2006

Update of Figure 66 on page 25. Disclaimer update.

11-May-2007

Corrected value of PSRR in Table 5 on page 6 from 1 to 61 (typical value).

Moved Table 3: Component descriptions to Section 2: Typical application

schematics on page 4.

Merged daisy chain flip-chip order code table into Table 11: Order codes

on page 31.

17-Jan-2008

Corrected pitch error in DFN8 package information. Actual pitch is 0.5mm.

Updated DFN8 package dimensions to correspond to JEDEC databook

definition (in previous versions of datasheet, package dimensions were as

in manufacturer’s drawing).

Corrected error in MiniSO-8 package information (L and L1 values were

inverted).

Reformatted package information.

21-May-2008

Corrected value of output resistance vs. ground in standby mode:

removed from Table 2, and added in Table 4, Table 5, and Table 6.

30-Aug-2011

Updated DFN8 package (Figure 72)

Updated ECOPACK® text in Section 5: Package information

17-Jan-2019

Updated Table 11: Order codes

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