DocID9309 Rev 14

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TS4990

Package information

33

5.3

DFN8 package information

Note:

DFN8 exposed pad (E2 x D2) is connected to pin number 7. For enhanced thermal

performance, the exposed pad must be soldered to a copper area on the PCB, acting as a

heatsink. This copper area can be electrically connected to pin7 or left floating.

Figure 72. DFN8 3x3x0.90 mm package mechanical drawing (pitch 0.5 mm)

Table 9. DFN8 3x3x0.90 mm package mechanical data (pitch 0.5 mm)

Ref.

Dimensions

Millimeters

Mils

Min.

Typ.

Max.

Min.

Typ.

Max.

A

0.80

0.90

1.00

31.5

35.4

39.4

A1

0.02

0.05

0.8

2.0

A2

0.55

0.65

0.80

217

25.6

31.5

A3

0.20

7.9

b

0.18

0.25

0.30

7.1

9.8

11.8

D

2.85

3.00

3.15

112.2

118.1

124

D2

2.20

2.70

86.6

106.3

E

2.85

3.00

3.15

112.2

118.1

124

E2

1.40

1.75

55.1

68.9

e

0.50

19.7

L

0.30

0.40

0.50

11.8

15.7

19.7

ddd

0.08

3.1

D

D2

e

C

PLANE

SEATING

BOTTOM VIEW

b

5

8

1

23

4

6

7

0.15x45°

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