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TS4990

Package information

33

Figure 69. TS4990 footprint recommendations

Figure 70. Tape and reel specification (top view)

Device orientation

The devices are oriented in the carrier pocket with pin number A1 adjacent to the sprocket

holes.

Pad in Cu 18

m with Flash NiAu (2-6m, 0.2m max.)

150

m min.

500

m

500

m

=250m

=400m typ.

75µm min.

100

m max.

Track

Non Solder mask opening

=340m min.

Pad in Cu 18

m with Flash NiAu (2-6m, 0.2m max.)

150

m min.

500

m

500

m

=250m

=400m typ.

75µm min.

100

m max.

Track

Non Solder mask opening

=340m min.

User direction of feed

A

1

A

1

8

Die size X + 70µm

4

1.5

4

All dimensions are in mm

User direction of feed

A

1

A

1

A

1

A

1

8

Die size X + 70µm

4

1.5

4

All dimensions are in mm