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CB35000 数据表(PDF) 6 Page - STMicroelectronics |
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CB35000 数据表(HTML) 6 Page - STMicroelectronics |
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6 / 16 page ![]() CB35000 SERIES 6/16 ® Inside the slew rate sections the next slices of specialized designed components step on a 50 micron wide pattern. The first of these 50 micron wide sections is utilized for predriver circuits; these include specialized built in test functions for the I/O. The predriver of course interfaces the core signals controlling tristate and switching functions with the slew rate and output transistor sections but it also allows all Output Buffers to be driven high, low or put into tristate regardless of the state of the internal logic greatly simplifying parametric testing of the part and also assisting customers who wish to use this feature during board testing. Note that all output buffers can be tristated by this function including buffers that normally do not tristate. This test function also turns off all pull up or down devices and shuts down all differential receivers and converts them into standard CMOS receivers. Inside the predriver is a section of specialized transistors used to create the receiver functions. This section includes specialized non salicide protection resistor diodes to further protect the gates of the receiver devices from ESD and latch up. Also present in this section are devices that can be utilized to form various parameteriseable pull up, pull down and buskeeper functions. A full set of standard receivers with pull up and pull Table 4 Temperature (Junction) and Voltage Multipliers Temperature oCKT -55 0.77 -40 0.83 25 1.00 70 1.13 85 1.17 125 1.27 VDD KV 2.7 1.20 3.0 1.11 3.3 1.00 3.6 0.94 down devices is present in the library. The technologies supported match the output buffer capabilities and include, LVCMOS, LVTTL, GTL, CTL, Differential, etc. and a five volt interface capability. All pads except the sixteen corner pads can be configured as power or I/O pads. The configured power pads are known as placeable pads and have an associated current handling capability. Their placement is dependent on the types of output buffers used in the design. For rules governing the placement of pads, please contact your local SGS-THOMSON design centre. CORE LOGIC The propagation delays shown in the CB35000 data book are given for nominal processing, 3.3V operation, and 25 C temperature conditions. However there are additional factors that affect the delay characteristics of the macrocells. These include loading due to fanout and interconnect routing, voltage supply, junction temperature of the device, processing tolerance and input signal transition time. Prior to physical layout, the design system can estimate the delays associated with any critical path. The impact of the placement and routing can be accurately RC back annotated from the layout for final simulations of critical timing. The effects of junction temperature, (KT) and voltage supply (KV) on the delay numbers are summarized in Table 4. A third factor, is associated with process variation. This multiplier has a minimum of 0.8 and a maximum of 1.2. MACROCELLS AND MACROFUNCTIONS The CB35000 series has internal macrocells that are robust in variety and performance. The cell selection has been driven by the need of Synthesis and HDL based design techniques. This offering is rich in buffers, complex combinatorial cells and multi power drive cells, which allow the Synthesis tool to create a netlist compatible with the requirements of Place and Route tools. Macrofunctions are a series of soft-macros facilitating quick capture of large functional blocks and are available for such functions as counters, |
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