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L9301 数据表(PDF) 10 Page - STMicroelectronics

部件名 L9301
功能描述  Automotive octal low side driver or quad low side plus quad high side driver
PDF  54 Pages
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制造商  STMICROELECTRONICS [STMicroelectronics]
网页  http://www.st.com
标志 STMICROELECTRONICS - STMicroelectronics

L9301 数据表(HTML) 10 Page - STMicroelectronics

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Electrical specifications
L9301
10/54
DS11400 Rev 9
3.3
Operating range
3.4
Thermal data
Figure 3. Device assembled on 2s2p PCB with high density vias in contact with a metal plate
Table 5. Operating range
Symbol
Parameter
Min.
Max.
Unit
VB
Supply voltage
VB_UV
18
V
VDD
Stabilized supply voltage
VDD_UV
VDD_OV
V
VDD_IO
Logic output supply voltage
3.0
5.5
V
Table 6. Thermal data
Symbol
Parameter
Min.
Typ.
Max.
Unit
Tamb(1)
Operating ambient temperature
-40
-
125
°C
Tstg
Storage temperature
-40
-
150
°C
Tj
Junction temperature
-40
-
175
°C
Tsd
Thermal shutdown temperature
180
-
195
°C
Tsd-hys
Thermal shutdown temperature hysteresis
-
10
-
°C
1. For information only, in any case Tj limits must not exceed.
Table 7. Thermal resistance
Symbol
Parameter
Working conditions
Value
Unit
Rth j-amb
Junction to ambient
2s2p (4L) board; Natural convection(1)
27
°C/W
2s2p (4L) board on ECU metal plate(2)
8
°C/W
Rth j-bottom case Junction to bottom case
Bottom cold plate(3)
1
°C/W
Rth j-top case
Junction to top case
Top cold plate(4)
21
°C/W
Psij-top case
Psi Junction to top case
2s2p (4L) board; Natural convection (1)
2
°C/W
1. Jedec STD. JESD51.
2. Package assembled on 2s2p (4L) board. The board bottom side is in contact with a metal plate as per typical automotive
application (ECU system). See Figure 3.
3. Thermal resistance between the die and the bottom case surface in ideal contact and measured by cold plate as per Jedec
best practice guidelines (JESD51).
4. Thermal resistance between the die and the top case surface in ideal contact and measured by cold plate as per Jedec
best practice guidelines (JESD51).



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