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L9301 数据表(PDF) 27 Page - STMicroelectronics |
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L9301 数据表(HTML) 27 Page - STMicroelectronics |
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27 / 54 page ![]() DS11400 Rev 9 27/54 L9301 Low side driver 53 9.2 Electrical characteristics OUT5-8 5 V ≤ VB < 18 V; -40 °C ≤ Tj ≤ 175 °C unless otherwise specified. 9.3 Driver diagnostic 9.3.1 Thermal protection Each solenoid channel has a dedicated temperature sensor that continuously monitors the temperature of the PowerMOS. In case the shutdown temperature Tsd is reached the related channel is turned off and the dedicated diagnostic bits are set. t_sdl_x is the bit that latches the thermal shut down and it is cleared after sending dedicated SPI to clear the bit, t_sd_x is the other thermal shut down bit and once it is set by thermal shut down condition it is cleared only when the Tj decreases below the thermal shut down threshold (hysteresis). If the microcontroller, when the device Table 20. Low-side drivers OUT5-8 electrical characteristics Pin Symbol Parameter Test condition Min. Typ. Max. Unit OUT5-8 RDS-on_LS Drain–source resistance I_load = 2 A - - 0,3 Ω IOUT_LK_LS Output leakage current OUTx = 13.5 V - - 10 µA VS/R_s_LS Voltage S/R on/off “slow” VB = 13.5 V Load: 8 Ω, 10 nF – From 80% to 30% of OUTx 2 4 6 V/µs VS/R_f_LS Voltage S/R on/off “fast” VB = 13.5 V Load: 8 Ω, 10 nF – From 80% to 30% of VOUT 5 10 15 V/µs Tturn-on_LS Turn-on delay time From command to 80% OUTx Load: 8 Ω, 10 nF - - 3 µs Tturn-off_LS Turn-off delay time From command to 30% OUTx Load: 8 Ω, 10 nF - - 3 µs Min_duty Minimum ON/OFF time of INx or SPI CMDx Note for application - - 28 µs VCL_LS Output clamping voltage I_load = 1.25 A T = 130 °C 34 37.5 41 V I_load = 1.25 A T= -40 °C and 25 °C 35 37.5 41 EclampSP_LS Energy repetitive pulse LS configuration I_load = 2.2 A, Tj = 150 °C, 100 kpulses - - 15 mJ EclampSP_LS Single pulse energy LS configuration I_load = 2.2 A, Tj = 150 °C - 18.1 mJ |
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