www.ti.com

EXAMPLE BOARD LAYOUT

14X

(1.27)

(16.25)

0.07 MAX

ALL AROUND

0.07 MIN

ALL AROUND

16X (0.6)

16X (2)

(14.25)

(R0.05)

TYP

(DIM B)

16X (DIM C)

16X (0.6)

(DIM A)

14X

(1.27)

(R0.05)

TYP

SOIC - 2.65 mm max height

DWW0016A

PLASTIC SMALL OUTLINE

4221501/B 10/2024

OPTION

DIM A

DIM B

DIM C

01

16.375

14.5

1.875

02

16.625

15

1.625

03

16.725

15.2

1.525

SYMM

SYMM

LAND PATTERN EXAMPLE

STANDARD

SCALE:3X

1

8

9

16

NOTES: (continued)

5. Publication IPC-7351 may have alternate designs.

6. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

METAL

OPENING

SOLDER MASK

NON SOLDER MASK

DEFINED

(PREFERRED)

SOLDER MASK DETAILS

SOLDER MASK

METAL UNDER

SOLDER MASK

OPENING

SOLDER MASK

DEFINED

PCB CLEARANCE & CREEPAGE OPTIMIZED

LAND PATTERN EXAMPLE

SCALE:3X

SYMM

SYMM

1

8

9

16

ISO7842, ISO7842F

SLLSEJ0I – OCTOBER 2014 – REVISED JULY 2025

www.ti.com

32

Submit Document Feedback

Copyright © 2025 Texas Instruments Incorporated

Product Folder Links: ISO7842 ISO7842F