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EXAMPLE STENCIL DESIGN

(16.25)

14X (1.27)

16X (2)

16X (0.6)

(R0.05) TYP

16X (DIM C)

16X (0.6)

14X (1.27)

(DIMA)

(DIM B)

(R0.05) TYP

SOIC - 2.65 mm max height

DWW0016A

PLASTIC SMALL OUTLINE

4221501/B 10/2024

OPTION

DIM A

DIM B

DIM C

01

16.375

14.5

1.875

02

16.625

15

1.625

03

16.725

15.2

1.525

NOTES: (continued)

7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

8. Board assembly site may have different recommendations for stencil design.

STANDARD

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL

SCALE:4X

SYMM

SYMM

1

8

9

16

PCB CLEARANCE & CREEPAGE OPTIMIZED

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL

SCALE:4X

SYMM

SYMM

1

8

9

16

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ISO7842, ISO7842F

SLLSEJ0I – OCTOBER 2014 – REVISED JULY 2025

Copyright © 2025 Texas Instruments Incorporated

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