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TLV2172IDRG4 数据表(PDF) 29 Page - Texas Instruments

部件名 TLV2172IDRG4
功能描述  TLVx172 36-V, single-supply, low-power operational amplifier for cost-sensitive systems
PDF  49 Pages
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制造商  TI2 [Texas Instruments]
网页  https://www.ti.com
标志 TI2 - Texas Instruments

TLV2172IDRG4 数据表(HTML) 29 Page - Texas Instruments

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PACKAGE MATERIALS INFORMATION
www.ti.com
24-Jul-2025
TAPE AND REEL INFORMATION
Reel Width (W1)
REEL DIMENSIONS
A0
B0
K0
W
Dimension designed to accommodate the component length
Dimension designed to accommodate the component thickness
Overall width of the carrier tape
Pitch between successive cavity centers
Dimension designed to accommodate the component width
TAPE DIMENSIONS
K0
P1
B0 W
A0
Cavity
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Pocket Quadrants
Sprocket Holes
Q1
Q1
Q2
Q2
Q3
Q3
Q4
Q4
User Direction of Feed
P1
Reel
Diameter
*All dimensions are nominal
Device
Package
Type
Package
Drawing
Pins
SPQ
Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
TLV172IDBVR
SOT-23
DBV
5
3000
180.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
TLV172IDBVR
SOT-23
DBV
5
3000
180.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
TLV172IDBVT
SOT-23
DBV
5
250
180.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
TLV172IDCKR
SC70
DCK
5
3000
178.0
9.0
2.4
2.5
1.2
4.0
8.0
Q3
TLV172IDCKRG4
SC70
DCK
5
3000
178.0
9.0
2.4
2.5
1.2
4.0
8.0
Q3
TLV172IDCKT
SC70
DCK
5
250
178.0
9.0
2.4
2.5
1.2
4.0
8.0
Q3
TLV172IDR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
TLV2172IDGKR
VSSOP
DGK
8
2500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
TLV2172IDGKT
VSSOP
DGK
8
250
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
TLV2172IDGKTG4
VSSOP
DGK
8
250
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
TLV2172IDR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
TLV2172IDRG4
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
TLV4172IDR
SOIC
D
14
2500
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
TLV4172IPWR
TSSOP
PW
14
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
Pack Materials-Page 1



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