TPS2061DBVRG4 datasheet(21/55 Pages) TI2

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9 Application and Implementation

Note

Information in the following applications sections is not part of the TI component specification,

and TI does not warrant its accuracy or completeness. TI’s customers are responsible for

determining suitability of components for their purposes, as well as validating and testing their design

implementation to confirm system functionality.

9.1 Application Information

9.1.1 Power-supply Considerations

OC1

EN1

OC2

0.1 µF

22 µF

0.1 µF

22 µF

Load

OUT1

OUT2

Power Supply

2.7 V to 5.5 V

EN2

GND

0.1 µF

TPS2062

Figure 9-1. Typical Application

A 0.01-μF to 0.1-μF ceramic bypass capacitor between IN and GND, close to the device, is recommended.

Placing a high-value electrolytic capacitor on the output pin(s) is recommended when the output load is heavy.

This precaution reduces power-supply transients that may cause ringing on the input. Additionally, bypassing the

output with a 0.01-μF to 0.1-μF ceramic capacitor improves the immunity of the device to short-circuit transients.

9.1.2 OC Response

The OCx open-drain output is asserted (active low) when an overcurrent or overtemperature shutdown

condition is encountered after a 10-ms deglitch timeout. The output remains asserted until the overcurrent or

overtemperature condition is removed. Connecting a heavy capacitive load to an enabled device can cause a

momentary overcurrent condition; however, no false reporting on OCx occurs due to the 10-ms deglitch circuit.

The TPS206x is designed to eliminate false overcurrent reporting. The internal overcurrent deglitch eliminates

the need for external components to remove unwanted pulses. OCx is not deglitched when the switch is turned

off due to an overtemperature shutdown.

GND

EN1

EN2

OC1

OC2

OUT1

OUT2

TPS2062

Rpullup

V+

Figure 9-2. Typical Circuit for the OC Pin

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TPS2061, TPS2062, TPS2063

TPS2065, TPS2066, TPS2067

SLVS490K – DECEMBER 2003 – REVISED JUNE 2024

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