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TPS2061DBVRG4 数据表(PDF) 40 Page - Texas Instruments |
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TPS2061DBVRG4 数据表(HTML) 40 Page - Texas Instruments |
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40 / 55 page ![]() www.ti.com PACKAGE OUTLINE C 6X 0.65 2X 1.95 8X 0.37 0.26 5.05 4.75 TYP SEATING PLANE 0.15 0.05 0.25 GAGE PLANE 0 -8 1.1 MAX 0.23 0.13 1.60 1.34 1.92 1.66 B 3.1 2.9 NOTE 4 A 3.1 2.9 NOTE 3 0.7 0.4 HVSSOP - 1.1 mm max height DGN0008C SMALL OUTLINE PACKAGE 4218838/A 11/2017 1 4 5 8 0.1 C A B PIN 1 INDEX AREA SEE DETAIL A 0.1 C NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side. 5. Reference JEDEC registration MO-187. A 20 DETAIL A TYPICAL SCALE 4.000 EXPOSED THERMAL PAD 1 4 5 8 9 |
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