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EXAMPLE STENCIL DESIGN

8X (1.4)

8X (0.45)

6X (0.65)

(4.4)

(R0.05) TYP

(1.57)

BASED ON

0.125 THICK

STENCIL

(1.89)

BASED ON

0.125 THICK

STENCIL

PowerPAD

HVSSOP - 1.1 mm max height

DGN0008G

SMALL OUTLINE PACKAGE

4225480/C 11/2024

1.33 X 1.60

0.175

1.43 X 1.73

0.15

1.57 X 1.89 (SHOWN)

0.125

1.76 X 2.11

0.1

SOLDER STENCIL

OPENING

STENCIL

THICKNESS

NOTES: (continued)

10. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

11. Board assembly site may have different recommendations for stencil design.

TM

SOLDER PASTE EXAMPLE

EXPOSED PAD 9:

100% PRINTED SOLDER COVERAGE BY AREA

SCALE: 15X

SYMM

SYMM

1

4

5

8

METAL COVERED

BY SOLDER MASK

SEE TABLE FOR

DIFFERENT OPENINGS

FOR OTHER STENCIL

THICKNESSES