www.ti.com

EXAMPLE BOARD LAYOUT

0.05 MAX

ALL AROUND

0.05 MIN

ALL AROUND

8X (1.4)

8X (0.45)

6X (0.65)

(4.4)

(R0.05) TYP

(2)

NOTE 10

(3)

NOTE 10

(1.22)

(0.55)

(

0.2) TYP

VIA

(1.65)

(1.84)

PowerPAD VSSOP - 1.1 mm max height

DGN0008K

SMALL OUTLINE PACKAGE

4231889/A 05/2025

NOTES: (continued)

7. Publication IPC-7351 may have alternate designs.

8. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

9. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown

on this view. It is recommended that vias under paste be filled, plugged or tented.

10. Size of metal pad may vary due to creepage requirement.

TM

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE: 15X

SYMM

SYMM

1

4

5

8

SOLDER MASK

DEFINED PAD

METAL COVERED

BY SOLDER MASK

SEE DETAILS

9

15.000

METAL

SOLDER MASK

OPENING

METAL UNDER

SOLDER MASK

SOLDER MASK

OPENING

EXPOSED METAL

EXPOSED METAL

SOLDER MASK DETAILS

NON-SOLDER MASK

DEFINED

(PREFERRED)

SOLDER MASK

DEFINED