数据搜索系统,热门电子元器件搜索
  Chinese  ▼
ALLDATASHEETCN.COM

X  

TPS7A0233DBVR 数据表(PDF) 27 Page - Texas Instruments

部件名 TPS7A0233DBVR
功能描述  TPS7A02 Nanopower IQ, 25-nA, 200-mA, Low-Dropout Voltage Regulator With Fast Transient Response
PDF  48 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
制造商  TI2 [Texas Instruments]
网页  https://www.ti.com
标志 TI2 - Texas Instruments

TPS7A0233DBVR 数据表(HTML) 27 Page - Texas Instruments

Back Button TPS7A0233DBVR Datasheet HTML 23Page - Texas Instruments TPS7A0233DBVR Datasheet HTML 24Page - Texas Instruments TPS7A0233DBVR Datasheet HTML 25Page - Texas Instruments TPS7A0233DBVR Datasheet HTML 26Page - Texas Instruments TPS7A0233DBVR Datasheet HTML 27Page - Texas Instruments TPS7A0233DBVR Datasheet HTML 28Page - Texas Instruments TPS7A0233DBVR Datasheet HTML 29Page - Texas Instruments TPS7A0233DBVR Datasheet HTML 30Page - Texas Instruments TPS7A0233DBVR Datasheet HTML 31Page - Texas Instruments Next Button
Zoom Inzoom in Zoom Outzoom out
 27 / 48 page
background image
8.2.3 Application Curve
Output Current (mA)
84
86
88
90
92
94
96
98
100
102
0.001
0.01
0.1
1
10
100
Curr
TJ
-55°C
-40°C
0°C
25°C
85°C
125°C
140°C
Figure 8-5. Current Efficiency vs IOUT and Temperature
8.3 Power Supply Recommendations
This device is designed to operate from an input supply voltage range of 1.5 V to 6.0 V. The input supply must
be well regulated and free of spurious noise. To ensure that the output voltage is well regulated and dynamic
performance is optimum, the input supply must be at least VOUT(nom) + 0.5 V. TI highly recommends using a 1-µF
or greater input capacitor to reduce the impedance of the input supply, especially during transients.
8.4 Layout
8.4.1 Layout Guidelines
• Place input and output capacitors as close to the device as possible.
• Use copper planes for device connections to optimize thermal performance.
• Place thermal vias around the device to distribute the heat.
• Do not place a thermal via directly beneath the thermal pad of the DQN package. A via can wick solder or
solder paste away from the thermal pad joint during the soldering process, leading to a compromised solder
joint on the thermal pad.
8.4.2 Layout Examples
COUT
VOUT
VIN
GND PLANE
CIN
Represents via used for
application specific connections
1
2
3
4
Figure 8-6. Layout Example for the DQN Package
www.ti.com
TPS7A02
SBVS277C – JULY 2019 – REVISED SEPTEMBER 2022
Copyright © 2022 Texas Instruments Incorporated
Submit Document Feedback
27
Product Folder Links: TPS7A02



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48


数据表 下载

Go To PDF Page


链接网址



ALLDATASHEET是否为您带来帮助?  [ DONATE ] 

关于 Alldatasheet   |   广告服务   |   联系我们   |   隐私政策   |   数据表链接    |   链接交换   |   制造商名单
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com