1

2

A

B

Not to scale

IN

OUT

EN

GND

Figure 5-3. YCH Package, 4-Pin DSBGA, 0.35-mm

Pitch (Top View)

1

2

B

A

Not to scale

EN

GND

IN

OUT

Figure 5-4. YCH Package, 4-Pin DSBGA, 0.35-mm

Pitch (Bottom View)

Table 5-2. Pin Functions: YCH

PIN

I/O

DESCRIPTION

YCH

NAME

A1

IN

Input

Input pin. For best transient response and to minimize input impedance, use the recommended

value or larger ceramic capacitor from IN to ground; see the Recommended Operating

Conditions table. Place the input capacitor as close to input of the device as possible.

A2

OUT

Output

Regulated output pin. A 0.5-µF or greater effective capacitance is required from OUT to ground

for stability. For best transient response, use a 1-µF or larger ceramic capacitor from OUT

to ground. Place the output capacitor as close to output of the device as possible; see the

Recommended Operating Conditions table.

B1

EN

Input

Enable pin. Driving this pin to logic high enables the device; driving this pin to logic low or floating

this pin disables the device. This pin features an internal pulldown resistor, which is disconnected

when EN is driven high externally and the device has started up.

B2

GND

—

Ground pin. This pin must be connected to ground and the thermal pad.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

Voltage

VIN

–0.3

6.5

V

VEN

–0.3

6.5

VOUT

–0.3

VIN + 0.3 or 5.5(2)

Current

Maximum output

Internally limited

A

Temperature

Operating junction, TJ

–40

150

°C

Storage, Tstg

–65

150

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress

ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under

Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

(2)

Maximum is VIN + 0.3 V or 5.5 V, whichever is smaller.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±1000

V

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±500

(1)

JEDEC document JEP155 states that 500-V HBM allows safemanufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safemanufacturing with a standard ESD control process.

TPS7A02

SBVS277C – JULY 2019 – REVISED SEPTEMBER 2022

www.ti.com

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