6.3 Recommended Operating Conditions

over operating junction temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VIN

Input voltage

1.5

6.0

V

VEN

Enable voltage

0

6.0

V

VOUT

Output voltage

0.8

5.0

V

IOUT

Output current

0

200

mA

CIN

Input capacitor

1

µF

COUT

Output capacitor(1) (2)

1

1

22

µF

FEN

EN toggle frequency

10

kHz

TJ

Operating junction temperature

–40

125

°C

(1)

Effective output capacitance of 0.5 µF minimum required for stability.

(2)

22 µF is the maximum derated capacitance that can be used for stability.

6.4 Thermal Information

THERMAL METRIC(1)

TPS7A02

UNIT

DQN (X2SON)

DBV (SOT-23-5)

YCH (DSBGA)

4 PINS

5 PINS

4 PINS

RθJA

Junction-to-ambient thermal resistance

179.1

181.9

201.1

°C/W

RθJC(top)

Junction-to-case(top) thermal resistance

137.6

53.0

2.3

°C/W

RθJB

Junction-to-board thermal resistance

116.3

88.1

67.3

°C/W

ψJT

Junction-to-top characterization parameter

6.1

27.1

1.1

°C/W

ψJB

Junction-to-board characterization parameter

116.3

52.7

67.2

°C/W

RθJC(bot)

Junction-to-case(bottom) thermal resistance

112.3

N/A

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

www.ti.com

TPS7A02

SBVS277C – JULY 2019 – REVISED SEPTEMBER 2022

Copyright © 2022 Texas Instruments Incorporated

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