IMSC011 datasheet(23/30 Pages) STMICROELECTRONICS

23 / 30 page

7 Electrical specifications

/30

7.4

Power rating

Internal power dissipation (PINT) of transputer and peripheral chips depends on VDD, as shown in

figure 7.6. PINT is substantially independent of temperature.

Power

PINT

(mW)

4.4

4.6

5.0

5.6

200

150

100

4.8

5.2

5.4

VDD (Volts)

Figure 7.6

IMS C011 internal power dissipation vs VDD

Total power dissipation (PD) of the chip is

PD = PINT + PIO

where PIO is the power dissipation in the input and output pins; this is application dependent.

Internal working temperature TJ of the chip is

TJ = TA + qJA *PD

where TA is the external ambient temperature in oC and q JA is the junction-to-ambient thermal resistance

in oC/W.

Information about device thermal management can be found in the following SGS-THOMSON cata-

logues, available from SGS-THOMSON sales offices and authorized distributors worldwide.

Thermal Management in Surface Mount Technology,

order code: BRTHERMAN/0788

Reliability in Surface Mount Technology,

order code: BRRELSMT/1088

IMSC011 数据表(PDF) 23 Page - STMicroelectronics

IMSC011 数据表(HTML) 23 Page - STMicroelectronics

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30

数据表下载