TLV9032DDFR.A datasheet(7/85 Pages) TI2

7 / 85 page

5 Specifications

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

Supply voltage

VS = (V+) – (V–)

–0.3

Input pins

(IN+, IN–) from V–(2)

–0.3

Current into Input pins

(IN+, IN–)

–10

Output

(OUT) from V–, open drain only(3)

–0.3

Output

(OUT) from V–, push-pull only

–0.3

(V+) + 0.3

Output

short circuit duration(4)

Junction temperature

150

°C

Storage temperature

Tstg

–65

150

°C

(1)

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.

If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully

functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.

(2)

Input terminals are diode-clamped to (V–). Input signals that can swing more than 0.3V beyond the supply rails must be current-limited

to 10mA or less. Additionally, Inputs (IN+, IN–) can be greater than V+ and OUT as long as the input is within the –0.3V to 6V range

(3)

Output (OUT) for open drain can be greater than V+ and inputs (IN+, IN–) as long as the pins are within the –0.3V to 6V range

(4)

Short-circuit to V– or V+. Short circuits from outputs can cause excessive heating and eventual destruction.

5.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic

discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±1000

(1)

JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process.

5.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Supply voltage

VS = (V+) – (V–)

1.65

5.5

Input voltage range

(IN+, IN–) from (V–)

–0.2

5.7

Ambient temperature

–40

125

°C

5.4 Thermal Information, TLV90x0,TLV90x1

THERMAL METRIC (1)

TLV90x0,TLV90x1

UNIT

DCK

(SC-70)

DBV

(SOT-23)

5 PINS

RqJA

Junction-to-ambient thermal resistance

238.5

223.7

°C/W

RqJC(top)

Junction-to-case (top) thermal resistance

134.0

123.2

°C/W

RqJB

Junction-to-board thermal resistance

87.6

91.4

°C/W

yJT

Junction-to-top characterization parameter

59.1

58.7

°C/W

yJB

Junction-to-board characterization parameter

87.2

91.0

°C/W

RqJC(bot)

Junction-to-case (bottom) thermal resistance

–

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

note.

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