TLV9032DDFR.A datasheet(8/85 Pages) TI2

8 / 85 page

5.5 Thermal Information, TLV90x2

THERMAL METRIC (1)

TLV90x2

UNIT

(SOIC)

(TSSOP)

DGK

(VSSOP)

DSG

(WSON)

DDF

(SOT-23)

8 PINS

RqJA

Junction-to-ambient thermal resistance

167.7

221.7

215.8

175.2

240.0

°C/W

RqJC(top)

Junction-to-case (top) thermal resistance

107.0

109.1

105.2

178.1

151.0

°C/W

RqJB

Junction-to-board thermal resistance

111.2

152.5

137.5

139.5

157.0

°C/W

yJT

Junction-to-top characterization parameter

53.1

36.4

39.6

47.2

32.8

°C/W

yJB

Junction-to-board characterization parameter

110.4

150.7

135.9

138.9

155.4

°C/W

RqJC(bot)

Junction-to-case (bottom) thermal resistance

–

127.3

–

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

note.

5.6 Thermal Information, TLV90x4

THERMAL METRIC(1)

TLV90x4

UNIT

D (SOIC)

(TSSOP)

RUC

(X2QFN)

RTE

(WQFN)

DYY

(SOT-23)

14 PINS

16 PINS

14 PINS

RqJA

Junction-to-ambient thermal resistance

136.0

155.0

215.0

134.1

211.1

°C/W

RqJC(top)

Junction-to-case (top) thermal resistance

91.2

82.0

77.5

122.6

121.1

°C/W

RqJB

Junction-to-board thermal resistance

92.0

98.5

160.3

109.3

120.4

°C/W

yJT

Junction-to-top characterization parameter

46.9

25.7

10.0

30.9

22.3

°C/W

yJB

Junction-to-board characterization parameter

91.6

97.6

160.1

108.3

120.1

°C/W

RqJC(bot)

Junction-to-case (bottom) thermal resistance

–

98.7

–

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

TLV9020, TLV9021, TLV9022, TLV9024, TLV9030, TLV9031, TLV9032, TLV9034

SNOSDA3H – JUNE 2020 – REVISED NOVEMBER 2025

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