ID2006

Chipown

www.chipown.com

Wuxi Chipown Microelectronics Limited

Rev.1.0

3/7

Absolute Maximum Ratings

Exceeding these ratings may damage the device.

The absolute maximum ratings are stress ratings only at TA=25°C, unless otherwise specified.

Symbol

Definition

MIN.

MAX.

Units

VB

High side floating supply

-0.3

220

V

VS

High side floating supply return

VB – 20

VB + 0.3

VHO

High side gate drive output

VS – 0.3

VB + 0.3

VCC

Low side and main power supply

-0.3

20

VLO

Low side gate drive output

-0.3

VCC + 0.3

VIN

Logic input of HIN & LIN

-0.3

VCC + 0.3

ESD

HBM Model

1.5

--

kV

CDM Model

500

--

V

PD

Package Power Dissipation @ TA ≤25°C

--

0.625

W

RthJA

Thermal Resistance Junction to Ambient

--

200

°C /W

TJ

Junction Temperature

--

150

°C

TS

Storage Temperature

-55

150

TL

Lead Temperature (Soldering, 10 seconds)

--

300

Recommended Operating Conditions

Symbol

Definition

MIN.

MAX.

Units

VB

High side floating supply

VS + 6

VS + 18

V

VS

High side floating supply return

-9

200

VHO

High side gate drive output voltage

VS

VB

VCC

Low side supply

6

18

VLO

Low side gate drive output voltage

0

VCC

VIN

logic input voltage (HIN &

LIN)

0

VCC

TA

Ambient temperature

-40

125

°C