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ID2006SEC-R1 数据表(PDF) 6 Page - Wuxi Chipown Micro-electronics limited |
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ID2006SEC-R1 数据表(HTML) 6 Page - Wuxi Chipown Micro-electronics limited |
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6 / 7 page ![]() ID2006 Chipown www.chipown.com Wuxi Chipown Microelectronics Limited Rev.1.0 6/7 Package Information SOP8 Package Outlines and Dimensions D A3 A2 A A1 L L1 θ c 0.25 b e B B E1 E BASE METAL SECTION B-B WITH PLATING b b1 c1 c h Size Symbol Min. (mm) Typ. (mm) Max. (mm) Size Symbol Min. (mm) Typ. (mm) Max. (mm) A - - 1.75 D 4.70 4.90 5.10 A1 0.10 - 0.225 E 5.80 6.00 6.20 A2 1.30 1.40 1.50 E1 3.70 3.90 4.10 A3 0.60 0.65 0.70 e 1.27BSC b 0.39 - 0.48 h 0.25 - 0.50 b1 0.38 0.41 0.43 L 0.50 - 0.80 c 0.21 - 0.26 L1 1.05BSC c1 0.19 0.20 0.21 θ 0 - 8° Top mark Package iDR. ID2006 YWWXXXXX SOP8 Note:Y:Year Code;WW:Week Code;XXXXX:Internal Code Notes: 1. This drawing is subjected to change without notice. 2. Body dimensions do not include mold flash or protrusion. |
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