6 Specifications

6.1 Absolute Maximum Ratings (1)

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Input voltage

VIN

–0.3

6

V

VEN

–0.3

VIN + 0.3

V

Operating temperature, TA

–55

150

°C

Junction temperature, Tj

150

°C

Storage temperature, Tstg

–65

150

°C

(1)

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.

If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully

functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±1000

V

Charged-device model (CDM), per JEDEC specification JESD22-C101(2)

±250

(1)

JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

MIN

NOM

MAX

UNIT

VIN

Supply input voltage

(IOUT = 0mA)

REF6025

3

5.5

V

REF6030, REF6033, REF6041, REF6045

VOUT + 0.25

5.5

REF6050

5.3

5.5

VEN

Enable voltage

0

VIN

V

IL

Output current

REF6025, REF6030, REF6033, REF6041

–4

4

mA

REF6045

–3.5

3.5

REF6050

–3

3

TA

Operating temperature

–40

25

125

°C

6.4 Thermal Information

THERMAL METRIC(1)

REF60xx

UNIT

DGK (VSSOP)

8 PINS

RθJA

Junction-to-ambient thermal resistance

158.5

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

51.2

°C/W

RθJB

Junction-to-board thermal resistance

79.5

°C/W

ψJT

Junction-to-top characterization parameter

5.2

°C/W

ψJB

Junction-to-board characterization parameter

78.0

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

REF60

SBOS708C – MAY 2016 – REVISED APRIL 2026

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