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R3111Q552B 数据表(PDF) 19 Page - Nisshinbo Micro Devices Inc. |
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R3111Q552B 数据表(HTML) 19 Page - Nisshinbo Micro Devices Inc. |
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19 / 43 page ![]() R3111x 19 R3111E (TO-92) is the discontinued product as of April, 2017. 600 500 400 300 200 100 0 0 25 50 75 100 125 150 Ambient Temperature ( C) Power Dissipation 85 On Board 380 150 Free Air Power Dissipation (SC-82AB) Power Dissipation (PD) depends on conditions of mounting on board. This specification is based on the measurement at the condition below; Measurement Conditions Standard Land Pattern Environment Mounting on Board (Wind velocity=0m/s) Board Material Glass cloth epoxy plastic (Double Layers) Board Dimensions 40mm 40mm 1.6mm Copper Ratio Top side: Approx. 50%, Back side: Approx. 50% Through-hole 0.5mm 44pcs Measurement Result (Ta=25 C, Tjmax=125C) Standard Land Pattern Free Air Power Dissipation 380mW 150mW Thermal Resistance ja=(125-25C)/0.38W=263C/W 667 C/W Measurement Board Pattern IC Mount Area (Unit : mm) 40 |
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