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R3111Q552B 数据表(PDF) 16 Page - Nisshinbo Micro Devices Inc. |
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R3111Q552B 数据表(HTML) 16 Page - Nisshinbo Micro Devices Inc. |
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16 / 43 page ![]() R3111x 16 R3111E (TO-92) is the discontinued product as of April, 2017. 600 500 400 300 200 100 0 0 25 50 75 100 125 150 Ambient Temperature ( C) 85 SON1612-6 Power Dissipation On Board Power Dissipation (SON1612-6) Power Dissipation (PD) depends on conditions of mounting on board. This specification is based on the measurement at the condition below: Measurement Conditions Standard Land Pattern Environment Mounting on Board (Wind velocity 0m/s) Board Material Glass cloth epoxy plastic (Double layers) Board Dimensions 40mm 40mm 1.6mm Copper Ratio Top side: Approx. 50%, Back side: Approx. 50% Through - hole 0.5mm 24pcs Measurement Results (Ta=25 C, Tjmax=125C) Standard Land Pattern Power Dissipation 500mW Thermal Resistance ja = (125-25C)/ 0.5W = 200C/W 40 39 27 Measurement Board Pattern IC Mount Area Unit : mm |
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