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R3111Q552B 数据表(PDF) 31 Page - Nisshinbo Micro Devices Inc. |
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R3111Q552B 数据表(HTML) 31 Page - Nisshinbo Micro Devices Inc. |
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31 / 43 page ![]() R3111x 31 R3111E (TO-92) is the discontinued product as of April, 2017. 0 25 50 75 100 125 150 Ambient Temperature ( C) Power Dissipation 85 1000 750 500 250 0 Free Air On Board 900 Power Dissipation (SOT-89-3) Power Dissipation (PD) depends on conditions of mounting on board. This specification is based on the measurement at the condition below: Measurement Conditions Standard Land Pattern Environment Mounting on Board (Wind velocity=0m/s) Board Material Glass cloth epoxy plastic (Double sided) Board Dimensions 50mm 50mm 1.6mm Copper Ratio Top side : Approx. 10% , Back side : Approx. 100% Through-hole - Measurement Result (Ta=25 C,Tjmax=125C) Standard Land Pattern Free Air Power Dissipation 900mW 500mW Thermal Resistance ja = (125-25C)/0.9W = 111C/W 200 C/W Measurement Board Pattern IC Mount Area Unit : mm 50 |
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